Low density polymers and methods of making and using same
US6020387A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Sep 22, 1997 |
| Grant date | Feb 1, 2000 |
| Priority date | — |
| Expiry date | Sep 22, 2017 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08K3/01
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A low density polymer composition including a polymer component capable of being cured, a low density filler in an amount sufficient to reduce the density of the polymer and a thixotrope present in a sufficient amount to impart a sufficient viscosity and to inhibit separation of the filler from the polymer until after the polymer is cured. The resulting lightweight, filled polymer composition is a strong electrical insulator, has low shrinkage, a low coefficient of thermal expansion, low cured density and a soft filler that does not harden the polymer. Methods of preparing and using the low density polymer compositions are also disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.