Thick plated interconnect and associated auxillary interconnect
US6020640A · kind A · utility
97Cited by
6References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 17, 1997 |
| Grant date | Feb 1, 2000 |
| Priority date | — |
| Expiry date | Dec 17, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A thick plated interconnect (80) comprising a copper lead (50) and a bonding cap (84) coupled to the copper lead (50). The bonding cap (84) may include a bondable member (86) formed from a bondable layer (62) comprising aluminum. A barrier member (88) may be formed from a barrier layer (60). The barrier member (88) may be disposed between the bondable member (86) and the copper lead (50).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.