High speed memory module
US6021048A · kind A · utility
Inventor
Key dates
| Filing date | Feb 17, 1998 |
| Grant date | Feb 1, 2000 |
| Priority date | — |
| Expiry date | Feb 17, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10159
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A high-speed memory module defined by first and second elements the first element including a plurality of flexible, interior layers laminated together to form a substrate having opposed exterior surfaces, the substrate having a network of conductive traces and vias forming data paths therein, at least two substantially quadrangular, rigid circuit boards, each of the boards laminarly split into substantially symmetric half-sections, each of the half-sections having solder lands formed on a first face for mounting electronic components thereto and conductive traces and vias incorporated therein forming a continuation of the data paths, each of the half-sections having an opposite second face for bonding to the exterior surfaces of the substrate, the half-sections laminated together on either side of a portion of the substrate with the substrate being sandwiched therebetween, wherein any gap between two parallel spaced-apart edges of any two adjacent boards is wide enough to allow mounting of the boards in a parallel, face-to-face, layered arrangement by folding the substrate at the gap, the gap being wide enough to allow for an air space between any opposite facing component attache…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.