Printed circuit boards with integrated passive components and method for making same
US6021050A · kind A · utility
97Cited by
26References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 2, 1998 |
| Grant date | Feb 1, 2000 |
| Priority date | — |
| Expiry date | Dec 2, 2018 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24926
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A multi-layered printed circuit board having a plurality of burried passive elements and a method for producing the circuit board wherein the passive elements can include resistors, capacitors and inductors. The method includes the steps of manufacturing individual layers of the multi-layer printed circuit board with electrical circuits thereon and subsequently screening polymer inks having resistive, dielectric or magnetic values to form the resistors, capacitors and inductors. Each layer of the circuit board is cured to dry the polymer ink and thereafter the individual layers are bonded together to form the multi-layer board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.