Acceleration sensor including an acceleration detection element bonded to a circuit substrate with a conductive bonding material
US6021671A · kind A · utility
5Cited by
6References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 5, 1998 |
| Grant date | Feb 8, 2000 |
| Priority date | — |
| Expiry date | Aug 5, 2018 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01P15/0915
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
An acceleration sensor includes a circuit substrate and an acceleration detection element. The acceleration detection element is mounted on the circuit substrate and formed by using a piezoelectric body and is constructed so as to detect an acceleration which acts in a shearing direction. An electrode formed on the circuit substrate and an electrode on the bottom surface of the acceleration detection element are bonded together via a conductive bonding material so that they do not have direct contact with each other.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.