Patent · US Expired

Bandsaw and process for cutting off slices from a workpiece

US6021772A · kind A · utility

6Cited by

11References

21Claims

0Family size

Assignee

Wacker Siltronic Gesellschaft Fur Halbleitermaterialien AG · DE

Inventors

Dieter Seifert · Vilshofen an der Donau, DE
Klemens Muehlbauer · Altötting, DE

Key dates

Filing date	Mar 13, 1998
Grant date	Feb 8, 2000
Priority date	—
Expiry date	Mar 13, 2018

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T83/8881
WIPO fieldOther special machines
WIPO sectorMechanical engineering

Abstract

A bandsaw for cutting off slices from a workpiece includes a sawband which circulates over a system of pulleys and has a band back and a cutting edge, which is situated opposite to the band back and is provided with a cutting surface. There is also a feed system, which effects a relative movement between the workpiece and the cutting edge, so that the sawband penetrates into the workpiece, thus forming a cutting gap. The bandsaw has a support plate, which supports the band back and is held by a holding device. There is also a process for cutting off slices from a workpiece using this bandsaw. A part of the support plate, which part adjoins the band back, also penetrates into the cutting gap during the cutting of the workpiece.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.