Manufacturing line for multi-layered printed circuit boards
US6021833A · kind A · utility
1Cited by
1References
21Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 12, 1996 |
| Grant date | Feb 8, 2000 |
| Priority date | — |
| Expiry date | Sep 12, 2016 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1339
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A manufacturing line including a plurality of processing sections disposed in a series for manufacturing multi-layered printed circuit boards by continuously conveying and processing boards through the plurality of processing sections, in which the plurality of processing sections have at least two specific processing sections for conducting a common type of processes, and the specific processing sections are disposed in a common area.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.