DC sputtering system
US6022462A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jun 26, 1997 |
| Grant date | Feb 8, 2000 |
| Priority date | — |
| Expiry date | Jun 26, 2017 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG11B7/26
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A DC sputtering system improved in prevention of fusion of a substrate and electric corrosion of a pallet revolving shaft due to the flow of negative electric charges at the time of production of an optical disk. The system includes a pair of electrodes, a negative electrode and a positive electrode, wherein the negative electrode is composed of a target plate made from a target material such as Si and a backing plate on which the target plate is fixedly placed, and the positive electrode is composed of a pallet disposed opposite to the negative electrode. A substrate of an optical disk is mounted on the positive electrode side through a disk base using an inner peripheral mask and an outer peripheral mask. Each of the inner peripheral mask and the outer peripheral mask is made from or covered with an electrically insulating material such as teflon or ceramic. This prevents the flow of negative electric chargers from being concentrated at the inner peripheral mask and the outer peripheral mask, to thereby protect the substrate from being fused.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.