Sensors with subminiature through holes
US6022463A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | May 16, 1996 |
| Grant date | Feb 8, 2000 |
| Priority date | — |
| Expiry date | May 16, 2016 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N33/4925
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
The present invention is a sensor having an electrode formed in electrical contact with a subminiature through hole. Because of the small diameter of the through hole, the material that fills the through hole and the through hole itself have an essentially negligible effect on the sensor. A relatively large number of sensors can be formed on the surface of the substrate within a relatively small fluid flowcell. Thus, more information can be attained using less analyte. The sensors of the present invention are preferably disposed on an alumina substrate which is essentially impervious to aqueous electrolytes and blood over long periods of storage in potentially corrosive environments. Since the substrate on which the sensors are deposited, and the encapsulants which insulate the conductive elements of the sensor do not break down or become unstable when exposed over time to such corrosive environments, the isolation that is provided remains very high between each sensor and each other sensor, between each sensor and each conduction path, and between each conduction path and each other conduction path. The superior isolation provides for a high level of accuracy in the sensor of the …
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.