Thermoplastic molding compounds and a method of reducing the formation of residual monomers in these molding compounds

US6022915A · kind A · utility

Assignee

• BASF SE

Inventors

• Anton Ticktin · Mannheim, DE
• Graham Edmund Mc Kee · Neustadt, DE
• Wolfgang Fischer · Meerbusch, DE
• Binnur Z. Gunesin · Uniontown, US
• Norbert Güntherberg · Speyer, DE

Key dates

• Filing date: May 12, 1998
• Grant date: Feb 8, 2000
• Expiry date: May 12, 2018

Classification

• Technology area (CPC C): Chemistry; Metallurgy
• CPC primary: C08K5/1545
• WIPO field: Macromolecular chemistry, polymers
• WIPO sector: Chemistry

Abstract

The invention relates to thermoplastic molding compositions consisting of PA1 A) 98-99.995% by weight, based on A+B, of at least one acrylonitrile-containing polymer, and PA1 B) 0.005-2% by weight, based on A+B, of .alpha.-tocopherol. The invention also relates to a method for reducing the formation of residual monomers on thermal stress and shearing of the thermoplastic molding compositions by adding .alpha.-tocopherol.