Semiconductor heater and method for making
US6023091A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Nov 30, 1995 |
| Grant date | Feb 8, 2000 |
| Priority date | — |
| Expiry date | Nov 30, 2015 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB41J2/33585
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
A sealable air gap (14) is formed between a heating element (16) and a base (11) to improve the thermal isolation of a semiconductor heater (10). A top layer (17) is formed over the heating element (16) which seals the air gap (14) so that the sealable air gap (14) can be at either atmospheric pressure or under a vacuum. The semiconductor heater (10) can be used in a variety of applications including as a heat source to adjust the resistivity of an overlying resistive layer (18). The embodiments of the semiconductor heater (10) also include a chemical sensor (20). Heat from a heating element (26) is used to keep an overlying layer of chemical sensing material (28) at an optimal temperature. The embodiments of the present invention also include a transducer (40) to heat a fluid (52) in a well (55) such as in an ink jet application.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.