Thermal management device and system for an electronic component enclosure
US6024165A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Aug 26, 1998 |
| Grant date | Feb 15, 2000 |
| Priority date | — |
| Expiry date | Aug 26, 2018 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF28D15/0275
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A thermal management device for an enclosure, the enclosure disposed in an environment exposed to ambient air and having an interior area for housing heat generating electronic components includes a heat exchanger having an evaporator portion and a condenser portion, the evaporator portion is adapted for mounting within the enclosure interior area adjacent to the heat generating electronic components. The condenser portion is exposed to the ambient air for removal of heat from the enclosure interior area generated by the electronic components adjacent to the heat exchanger evaporator portion. The device is incorporated in a system which includes an air duct disposed within the enclosure interior area. The duct includes an air inlet port and air outlet port. The ports communicate with the ambient air to thereby create an airflow path through the air duct from the inlet port to the outlet port. The condenser portion of the heat exchanger is adapted to communicate with the air flow path within the air duct, such that heat generated by the electronic components adjacent to the heat evaporator portion of the heat exchanger within the enclosure is removed from the enclosure through the a…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.