Thermal sensor assembly
US6024487A · kind A · utility
6Cited by
20References
27Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 3, 1999 |
| Grant date | Feb 15, 2000 |
| Priority date | — |
| Expiry date | Aug 3, 2019 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03G21/20
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
An infrared thermal sensor assembly for sensing the temperature of a target, the sensor assembly including a heat sink having a bore therethrough; a thermopile housed in the bore; and a heater operative to heat the heat sink.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.