Patent · US Expired

Mold-changing device in an ornamental body gluing apparatus

US6024820A · kind A · utility

3Cited by
2References
2Claims
0Family size

Assignee

Inventors

Key dates

Filing dateApr 30, 1998
Grant dateFeb 15, 2000
Priority date
Expiry dateApr 30, 2018

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY10T156/1744
  • WIPO fieldMachine tools
  • WIPO sectorMechanical engineering

Abstract

A device used for an ornamental body gluing apparatus is disclosed to reduce the work and time necessary to change molds. The device includes a cylinder mounted on a press-gluing station, the cylinder having an attaching plate to which a receiving plate is detachably attached; receiving-plate-holding bushes attached to the lower surface of the receiving plate; receiving-plate-holding cylinders mounted on the cope for engaging the receiving-plate-holding bushes; positioning bushes disposed on the upper surface of a drag; positioning pins disposed on a cope for engaging the positioning bushes; positioning bushes disposed on the upper surface of the cope; and positioning pins suspended from the bottom of the groove-fitting mold for engaging the positioning bushes disposed on the upper surface of the cope.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.