Method and apparatus for determining film thickness control conditions and discharging liquid to a rotating substrate
US6025012A · kind A · utility
21Cited by
2References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 19, 1996 |
| Grant date | Feb 15, 2000 |
| Priority date | — |
| Expiry date | Sep 19, 2016 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB05D1/005
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
The present invention provides an apparatus which is capable of discharging a process liquid to a rotating substrate at a very constant rate irrespective of variations in the state of the process liquid. A process liquid is discharged toward a rotating substrate by nozzles which are moved from inner to outer radius sides of the rotating substrate. The present invention further provides a method in which film thickness control conditions are determined based on a simulation of a behavior of a process liquid on a substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.