Semiconductor light-emitting device package and method of manufacturing the same
US6025213A · kind A · utility
20Cited by
7References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 14, 1997 |
| Grant date | Feb 15, 2000 |
| Priority date | — |
| Expiry date | May 14, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01S5/42
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A surface-emission semiconductor light-emitting device package can radiate heat from the front surface while emitting light to the front surface of the device. The package includes a semiconductor light-emitting device for emitting light to a semiconductor substrate in the upper direction and a package window portion formed of a transparent heat sink, wherein the semiconductor light-emitting device is bonded to the package window portion in accordance with an interconnection pattern. A method of manufacturing semiconductor light-emitting device package also is described.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.