Method for producing a plurality of semiconductor components

US6025251A · kind A · utility

Assignee

• Siemens Aktiengesellschaft · DE

Inventors

• Wolf Jakowetz · Vaterstetten, DE
• Helmut Fischer · Calw, DE

Key dates

• Filing date: Mar 9, 1999
• Grant date: Feb 15, 2000
• Expiry date: Mar 9, 2019

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/10157

Abstract

A semiconductor component includes a semiconductor body having a front side, a rear side and at least one curved side surface. As viewed from outside the semiconductor body, the at least one curved side surface is convex adjacent the rear side and concave adjacent the front side. The rear side has a greater area than the front side. A method is also provided for producing a plurality of the semiconductor components.