Power distribution system for semiconductor die
US6025616A · kind A · utility
16Cited by
20References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 25, 1997 |
| Grant date | Feb 15, 2000 |
| Priority date | — |
| Expiry date | Jun 25, 2017 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S257/903
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A power distribution system for a semiconductor die includes bonding pads located adjacent to and connected to power busses with connections between the bonding pads providing a parallel path for current. Connections may be provided by stitch bonds, by conductors within a substrate or by other means.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.