Resin-sealed semiconductor device, circuit member for use therein and method of manufacturing resin-sealed semiconductor device
US6025640A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jul 7, 1998 |
| Grant date | Feb 15, 2000 |
| Priority date | — |
| Expiry date | Jul 7, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/30107
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
There is disclosed a resin-sealed semiconductor device which comprises plural terminal portions integrally having inner terminals on surfaces and outer terminals on back surfaces and being disposed electrically independent of one another in such a manner that inner terminal surfaces are positioned on substantially the same plane; a die pad integrally provided with plural inner terminals on a surface and plural outer terminals on a back surface and being disposed electrically independently in a substantially center portion of the plane in which the plural terminal portions are arranged two-dimensionally; a semiconductor element electrically insulated and mounted on a surface of the die pad; and wires for connecting the inner terminals of the terminal portions and terminals of the semiconductor element. The whole is sealed with a resin in such a manner that the outer terminals of the terminal portions are partially exposed to the outside. In the device, the outer terminals integrally formed on the back surface of the die pad function as a heat release path for allowing heat generated on a circuit forming face of the semiconductor element to escape to the outside, and also function as…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.