Electromechanical switching device package with controlled impedance environment
US6025768A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Sep 8, 1999 |
| Grant date | Feb 15, 2000 |
| Priority date | — |
| Expiry date | Sep 8, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K1/182
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A reed switch package is disclosed that includes a reed switch with at least one electrical signal path. A cylindrical ground shield is provided about the reed switch. Ground terminals are connected to opposing sides of the ground shield so that the ground terminals are on opposing sides of the signal terminal and lie in the same plane. The reed switch resides on a support substrate. An electrically conductive signal via extends through said main body and connects to the signal terminal. Ground vias extend through the main body and respectively connect to the ground terminals. The grounds vias are on opposing sides of the signal via and lie in the same plane as the signal via. The signal and ground via exit at the bottom of the main body and are connected to a circuit via solder balls to provide a compact surface mount package with a controlled impedance environment.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.