Chip module for semiconductor chips having arbitrary footprints

US6025997A · kind A · utility

Assignee

• Siemens Aktiengesellschaft · DE

Inventors

• Michael Huber · Bad Abbach, DE
• Peter Stampka · Burglengenfeld, DE

Key dates

• Filing date: May 4, 1998
• Grant date: Feb 15, 2000
• Expiry date: May 4, 2018

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/01087
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A chip module has a contact layer made up of several electrically conductive contact elements. The contact elements have a front side with contact areas. A semiconductor chip is disposed above the contact layer. The semiconductor chip has a main area with a number of chip terminals that are electrically connected by means of bonding wires of a maximum mounting length to the back side of the respective contact elements. A thin insulating film of electrically insulating material is disposed between the contact layer and the semiconductor chip. The insulating film is formed with a multiplicity of bonding holes, which are arranged, shaped, numbered, and assigned to respective contact elements of the contact layer in such a way that, with any desired position and footprint of the attached semiconductor chip, an electrical bonding of the chip terminals with a respectively associated contact element of the contact layer is accomplished by means of the bonding wires.