Method for electrochemical fabrication
US6027630A · kind A · utility
261Cited by
26References
15Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Apr 3, 1998 |
| Grant date | Feb 22, 2000 |
| Priority date | — |
| Expiry date | Apr 3, 2018 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/239
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
An electroplating method that includes: a) contacting a first substrate with a first article, which includes a substrate and a conformable mask disposed in a pattern on the substrate; b) electroplating a first metal from a source of metal ions onto the first substrate in a first pattern, the first pattern corresponding to the complement of the conformable mask pattern; and c) removing the first article from the first substrate, is disclosed. Electroplating articles and electroplating apparatus are also disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.