Polishing composition
US6027669A · kind A · utility
33Cited by
4References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 5, 1997 |
| Grant date | Feb 22, 2000 |
| Priority date | — |
| Expiry date | Dec 5, 2017 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09G1/02
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
A polishing composition comprising fumed silica, a basic potassium compound and water, of which the specific electric conductivity is from 100 to 5,500 .mu.S/cm.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.