Encapsulant of crystalline epoxy resin and phenolic resin-crystalline epoxy resin reaction product
US6027812A · kind A · utility
2Cited by
1References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 14, 1998 |
| Grant date | Feb 22, 2000 |
| Priority date | — |
| Expiry date | Jan 14, 2018 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31511
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
An epoxy resin composition comprising a crystalline epoxy resin, a phenolic resin, and an inorganic filler is improved in moldability by previously reacting phenolic hydroxyl groups on the phenolic resin with epoxy groups on the crystalline epoxy resin to form a reaction product and blending the reaction product in the composition. The composition is moldable over semiconductor devices without voids and wire flow. The encapsulated semiconductor devices thus remain reliable.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.