Chip bead element and manufacturing method thereof
US6028353A · kind A · utility
14Cited by
7References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 11, 1998 |
| Grant date | Feb 22, 2000 |
| Priority date | — |
| Expiry date | Aug 11, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K1/181
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
The present invention relates to a laminated chip bead element demonstrating noise absorption characteristics over a broad range in a high frequency range of GHz or higher. An insulating body is constituted of a material achieved by mixing ferrite powder and an insulating resin. At least one signal conductor is embedded in the insulating body. It is desirable that the insulating body includes a plurality of composite members.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.