Probe head assembly
US6028437A · kind A · utility
35Cited by
10References
11Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | May 19, 1997 |
| Grant date | Feb 22, 2000 |
| Priority date | — |
| Expiry date | May 19, 2017 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R1/0735
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
An apparatus for testing semiconductor devices including probe tips for contacting input/output pads on the device attached to a probe membrane fixed to a package using a layer of elastomeric material. The elastomeric material and use of compliant bump probe tips effect a global planarization for improved electrical contact between the probe assembly and the input/output contacts on the device under test.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.