Inspection of solder bumps of bump-attached circuit board
US6028673A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jul 28, 1998 |
| Grant date | Feb 22, 2000 |
| Priority date | — |
| Expiry date | Jul 28, 2018 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K2101/40
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
An inspection beam is cast onto an inspection surface of a bump-attached circuit board, which inspection surface is provided with a plurality of solder bumps, and scanned within the inspection surface two-dimensionally while allowing its reflected beam to be received at PSD (Position Sensing Device). On the basis of detection output from a beam receiving section at that moment, information on heights at respective positions within the inspection surface and information on the brightness of the reflected beam are prepared. On the basis of the prepared reflected beam brightness information, an existing region of a top face of each bump (bump top face existing region) is fixed. By using information on height of each bump which is prepared on the basis of the information on the size or area of the bump top face existing region and the respective heights within the bump top face existing region, information on volume of each bump is prepared. A height value range is divide to a plurality of range sections by means of one or more hold values. The height value range sections are associated one-to-one with depths and/or colors of pixels of a splay device for thereby associating the depths …
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.