Method for producing a beam splitter molded part and optoelectronic module using the beam splitter molded part

US6028708A · kind A · utility

Assignee

• Siemens Aktiengesellschaft · DE

Inventors

• Wolfgang Gramann · Regensburg, DE
• Werner Spath · Holzkirchen, DE

Key dates

• Filing date: Mar 30, 1999
• Grant date: Feb 22, 2000
• Expiry date: Mar 30, 2019

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10S359/90
• WIPO field: Optics
• WIPO sector: Instruments

Abstract

A method is provided for producing at least one beam splitter molded part from transparent material in which a beam splitter layer is embedded. Two radiation-transparent wafers, of which one is provided with a beam splitter layer, are interconnected in such a way that the beam splitter layer lies between the two wafers. Subsequently, this wafer assembly is further processed to form individual prism ingots, for example by sawing them through into wafer strips and grinding or polishing lateral surfaces, or by profile sawing. An optoelectronic module for bidirectional optical data transmission uses the beam splitter molded part.