Wafer carrier assembly
US6030487A · kind A · utility
11Cited by
12References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 19, 1997 |
| Grant date | Feb 29, 2000 |
| Priority date | — |
| Expiry date | Jun 19, 2017 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B57/02
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A wafer carrier assembly including a subassembly for in-situ nondestructive pad conditioning, characterized by continuously cleansing the pad surface with an energized fluid. The fluid may be abrasive in nature, such as a slurry, or non-abrasive, such as DeIonized (DI) water. In addition, the fluid may be of a type known to assist in removing slurry and/or residual materials from a pad surface and followed by a DI water rinse. The chemical may be either liquid or gas.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.