Process for making a crystalline solid-solution powder with low electrical resistance
US6030507A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | May 14, 1998 |
| Grant date | Feb 29, 2000 |
| Priority date | — |
| Expiry date | May 14, 2018 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC01P2006/40
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
A process for making a crystalline solid-solution powder which involves reacting at least two reactants in a plasma arc of a plasma chamber and blast-cooling the resultant product in a high velocity gas stream to form the powder. The first reactant is a molten metal alloy and the second reactant is a gas. The reaction is carried out in a plasma arc and the products rapidly cooled by a gas stream acting at the outlet opening of the plasma chamber. The crystalline solid-solution powder formed by the process has a low electrical resistivity. If an indium-tin alloy is used as the first reactant and oxygen as the second reactant, there is obtained an indium-tin-oxide (ITO) crystalline solid-solution powder which, when compacted to 40% of its theoretical density, has an electrical resistivity in the range of about 2 .OMEGA.cm. This ITO crystalline solid-solution powder is particularly suitable for preparing an ITO target, with high electrical conductivity and thus high achievable sputtering rates.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.