Patent · US Expired

Method for fabricating metal micropatterns

US6030515A · kind A · utility

8Cited by
6References
8Claims
0Family size

Assignee

Inventors

Key dates

Filing dateJul 23, 1998
Grant dateFeb 29, 2000
Priority date
Expiry dateJul 23, 2018

Classification

  • Technology area (CPC B)Performing Operations; Transporting
  • CPC primaryB81C2201/0109
  • WIPO fieldMicro-structural and nano-technology
  • WIPO sectorChemistry

Abstract

A method for fabricating metal micropatterns. Trenches are introduced into a polymer layer. These trenches are filled with the metal micropatterns using an electroplating process. Before the deposition of the metal micropatterns, the side walls of the trenches are covered with insulating layers which adhere to the metal micropatterns after the polymer layer is removed.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.