Method for fabricating metal micropatterns
US6030515A · kind A · utility
8Cited by
6References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 23, 1998 |
| Grant date | Feb 29, 2000 |
| Priority date | — |
| Expiry date | Jul 23, 2018 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB81C2201/0109
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
A method for fabricating metal micropatterns. Trenches are introduced into a polymer layer. These trenches are filled with the metal micropatterns using an electroplating process. Before the deposition of the metal micropatterns, the side walls of the trenches are covered with insulating layers which adhere to the metal micropatterns after the polymer layer is removed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.