Electronic component
US6030709A · kind A · utility
18Cited by
3References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 11, 1997 |
| Grant date | Feb 29, 2000 |
| Priority date | — |
| Expiry date | Apr 11, 2017 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/12674
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
The invention relates to an electronic component manufactured in thick film technology, thin film technology or silicon technology and then provided with an electrically insulating layer which is covered by an amorphous metal layer. The amorphous metal layer protects the component, even with the smallest of layer thicknesses, from external influences and directly transmits heating and force effects.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.