Patent · US Expired

Method of compounding a multimodal polymer composition

US6031027A · kind A · utility

6Cited by
3References
10Claims
0Family size

Assignee

Inventors

Key dates

Filing dateMar 26, 1999
Grant dateFeb 29, 2000
Priority date
Expiry dateMar 26, 2019

Classification

  • Technology area (CPC B)Performing Operations; Transporting
  • CPC primaryB29C48/76
  • WIPO fieldOther special machines
  • WIPO sectorMechanical engineering

Abstract

A method of compounding a multimodal, preferably a bimodal polymer composition comprising a low molecular weight ethylene polymer and a high molecular weight ethylene polymer is described. The composition is compounded during a relatively long time at a low temperature which lies in a narrow temperature range including the melting point of the low molecular weight ethylene polymer. More particularly, the polymer composition is compounded, without addition of a beat transfer medium, in a temperature range from about 10.degree. C. below to about 10.degree. C. above the melting point of the low molecular weight ethylene polymer during a time of more than 10 seconds. The viscosity ratio between the ethylene polymers in said temperature range preferably is from about 5:1 to about 1:5.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.