Multi-circuit RF connections using molded and compliant RF coaxial interconnects
US6031188A · kind A · utility
9Cited by
16References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 30, 1998 |
| Grant date | Feb 29, 2000 |
| Priority date | — |
| Expiry date | Apr 30, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3011
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Interconnections are made through a planar circuit by a monolithic short-circuited transmission path which extends from a circuit portion of the planar circuit to the opposite side. The opposite side is ground sufficiently to remove the short-circuiting plate, thereby separating the previously monolithic conductors, and exposing ends of the separated conductors of the transmission path. Connection is made between the exposed conductors of the transmission path and the registered contacts of a second planar circuit by way of electrically conductive, compliant fuzz buttons. The transmission path may be a coaxial path useful for RF.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.