Adhesively- and solder-bonded capacitive filter feedthrough for implantable medical devices
US6031710A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Dec 18, 1997 |
| Grant date | Feb 29, 2000 |
| Priority date | — |
| Expiry date | Dec 18, 2017 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/435
- WIPO fieldMedical technology
- WIPO sectorInstruments
Abstract
A capacitive filter feedthrough assembly and method of making same are disclosed for shielding an implantable medical device such as pacemaker or defibrillator from electromagnetic interference or noise. A ferrule is adapted for mounting onto a conductive device housing by welding, soldering, brazing or gluing, and supports a terminal pin for feedthrough passage to a housing interior. A capacitive filter is mounted at the inboard side of a device housing, with capacitive filter electrode plate sets coupled respectively to the housing and the terminal pin by an electrically conductive combination of adhesive, brazing and soldering. In one embodiment of the invention, multiple capacitive filters are provided in an array within a common base structure, where each capacitive filter is associated with a respective terminal pin.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.