Cooling system for semiconductor die carrier
US6031720A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Nov 14, 1997 |
| Grant date | Feb 29, 2000 |
| Priority date | — |
| Expiry date | Nov 14, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A cooling system for a semiconductor die carrier is disclosed that includes a cooling fan disposed at a substantial distance from a semiconductor die carrier, a cooling duct including an inlet portion and an outlet portion, and a heat exchanger disposed on an upper surface of the semiconductor die carrier. The cooling duct inlet portion is attached to the cooling fan and the cooling duct outlet portion is disposed in close proximity to the heat exchanger. The cooling fan draws ambient air into the cooling duct and the ambient air exits the cooling duct outlet portion and passes in a heat exchange relationship with the heat exchanger.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.