Integral heater for reworking MCMS and other semiconductor components
US6031729A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jan 8, 1999 |
| Grant date | Feb 29, 2000 |
| Priority date | — |
| Expiry date | Jan 8, 2019 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49126
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A multi-chip module or other electronic semiconductor component (1) contains a multi-layer substrate (9) whose bottom surface, the bottom of the bottom layer (15) of that substrate, serves as the bonding surface for bonding the multi-chip module or component to a printed wiring board (8) using a thermally sensitive adhesive, such as a thermally sensitive adhesive or solder. The bottom layer (15) of that multi-layer substrate integrally includes a plurality of electrical heaters (16-28), arranged side by side. When energized with appropriate current, the heater generates sufficient heat to weaken the adhesive bond, allowing the MCM to be pulled away from the printed wiring board and removed, without weakening the bonding of the multiple layers of the laminate substrate or weakening the MCM component's bond to that substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.