Small volume heat sink/electronic assembly
US6031751A · kind A · utility
103Cited by
9References
35Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Apr 14, 1999 |
| Grant date | Feb 29, 2000 |
| Priority date | — |
| Expiry date | Apr 14, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/20936
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
A heat sink apparatus including a fluid conduit within a body portion wherein the body portion including at least one body member linked to the fluid conduit and forming at least first and second walls which are in different planes, the walls forming at least a first mounting surface for mounting heat generating devices.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.