Polishing tool
US6033449A · kind A · utility
2Cited by
8References
2Claims
0Family size
Inventors
Key dates
| Filing date | Nov 17, 1997 |
| Grant date | Mar 7, 2000 |
| Priority date | — |
| Expiry date | Nov 17, 2017 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24D3/22
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A polishing tool for polishing optical and technical glass, semiconductors, ceramics and other materials has a high concentration of cerium dioxide or aluminum oxide particles in the quantity of 85-96% by weight, and a high molecular binder based on synthetic rubber and including a combination of high-molecular components and other components for vulcanization, plasticization and stabilization.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.