Thermosetting resin compositions containing maleimide and/or vinyl compounds
US6034195A · kind A · utility
57Cited by
19References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 2, 1995 |
| Grant date | Mar 7, 2000 |
| Priority date | — |
| Expiry date | Jun 2, 2015 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08G73/121
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
In accordance with the present invention, there are provided novel thermosetting resin compositions which do not require solvent to provide a system having suitable viscosity for convenient handling. Invention compositions have the benefit of undergoing rapid cure. The resulting thermosets are stable to elevated temperatures, are highly flexible, have low moisture uptake and are consequently useful in a variety of applications, e.g., in adhesive applications since they display good adhesion to both the substrate and the device attached thereto.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.