Method and apparatus for supporting a component on a substrate
US6035523A · kind A · utility
8Cited by
5References
3Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 16, 1995 |
| Grant date | Mar 14, 2000 |
| Priority date | — |
| Expiry date | Jun 16, 2015 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49144
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A support is provided for a component on a substrate to minimize unacceptable bending or displacement. In a preferred embodiment, a suitable amount of a thermoplastic material is injected through a hole in a PCB under the component after the component has been affixed to the PCB. This allows the support material to fill any space between the component and the PCB yet allow for variation in lead height and for thermal expansion of the support material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.