Method for cutting a surgical suture at two locations
US6035751A · kind A · utility
7Cited by
50References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 28, 1998 |
| Grant date | Mar 14, 2000 |
| Priority date | — |
| Expiry date | Apr 28, 2018 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T83/896
- WIPO fieldMedical technology
- WIPO sectorInstruments
Abstract
An apparatus and method for cutting a surgical suture at a first and second different location along its length. The apparatus having a first and a second cutting die with channels for receiving at least a portion of the cross-section of the surgical suture at each location. Each of the first and second cutting dies respectively is provided with an opposing cutting die to further restraint the suture. A blade is also provided at each cutting location for cutting the suture at a point adjacent to the respective cutting dies when the suture is restrained between the sets of dies.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.