Patent · US Expired

Dry film photoresist

US6037100A · kind A · utility

10Cited by
10References
4Claims
0Family size

Assignee

Inventors

Key dates

Filing dateSep 29, 1998
Grant dateMar 14, 2000
Priority date
Expiry dateSep 29, 2018

Classification

  • Technology area (CPC G)Physics
  • CPC primaryG03F7/092
  • WIPO fieldOptics
  • WIPO sectorInstruments

Abstract

The present invention relates to a dry film photoresist comprising the steps of: PA1 preparing a photosensitive polymer prepared containing an acrylylic copolymer as a binder polymer, to which is added are a photopolymerizing monomer, photoinitiator, a photosensitive agent, color former, plasticizer and thermal stabilizer; drying the photosensitive polymer coated on a polyethylene terephthalate support in a predetermined thickness; and PA1 laminating a polyethylene terephthalate film with a certain surface property in a protective manner. Since the dry film photoresist of this invention is used for the manufacture of a printed circuit boards and lead frames and employs a polyethylene terephthalate film having excellent surface properties, any problems such as air admixture generated from the process may be avoided, unlike prior technologies using polyethylene film as a cover film, thus reducing significantly the defect rate of a final product.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.