Epoxy resin composition
US6037425A · kind A · utility
3Cited by
8References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 21, 1996 |
| Grant date | Mar 14, 2000 |
| Priority date | — |
| Expiry date | Nov 21, 2016 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08G59/066
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The present invention provides an epoxy resin composition useful for casting applications, comprising a reaction product obtained by reacting (A) a bisphenol epoxy resin, and (B) bisphenol compounds, and if necessary, (C) monofunctional phenols or carboxylic acid compounds, in the presence of sodium compounds, wherein the epoxy resin composition has PA1 (a) an epoxy equivalent: 250 to 500 g/equivalent, PA1 (b) a sodium content: 20 to 200 ppm, and PA1 (c) a haze of its 40 wt % methyl ethyl ketone solution measured according to ASTM D 1003: 15% or less.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.