Apparatus and method for forming a housing assembly
US6037541A · kind A · utility
16Cited by
17References
26Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 10, 1998 |
| Grant date | Mar 14, 2000 |
| Priority date | — |
| Expiry date | Mar 10, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01P1/2084
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
An apparatus and method for forming a housing assembly. The assembly comprises a first part with protrusions spaced along at least one surface which fit into through-holes in a second part and which may, when the parts are placed together, be peened such that the protrusions fill the through-holes and join the parts. The method comprises fabricating a first part with protrusions and a second part with through-holes, joining the parts together such that the protrusions mate with the through-holes, and peening the protrusions such that they fill the through-holes and join the parts.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.