Method for measuring material thickness profiles
US6038027A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Dec 18, 1998 |
| Grant date | Mar 14, 2000 |
| Priority date | — |
| Expiry date | Dec 18, 2018 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01B11/0691
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A method for determining a thickness of a moving material having at least two optical interfaces. A length of material is transported along a transport path through a measurement region, and is maintained at a substantially constant velocity and a predetermined flatness. A beam of light is directed toward the moving length disposed within the measurement region, and a portion of the light reflected from the optical interfaces of the moving length is collected and directed toward an interferometer apparatus. The interferometer apparatus generates an interference signal representative of the collected light and analyzes a plurality of the interference signals to determine a thickness profile of the material in the first direction.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.