Electrical component mounting assembly including special guide structure for receiving a component package regardless of orientation of the package relative to the guides
US6038131A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jan 13, 1998 |
| Grant date | Mar 14, 2000 |
| Priority date | — |
| Expiry date | Jan 13, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A mounting structure for mounting circuit components on circuit boards, and particularly for mounting packaged processors on computer mother-boards. The structure includes a pair of retractable guides for mounting the processor package onto the circuit board. The semi-finished circuit board can be prepared for further processing or transportation to a distant location by retracting the guides to greatly reduce the height and volume of each board. Then, when the boards are received, the guides can be erected and the processor package installed. The structure includes means for holding the guides erected to facilitate installation of the processor package, and holding the guides in folded position for processing and/or transportation. Also, each of the guides has a wall with two side-by-side latch openings for receiving offset latch members of the processor package regardless of the orientation of the package relative to the guides.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.