Method for assembling a jack assembly panel
US6038766A · kind A · utility
25Cited by
10References
2Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jun 28, 1999 |
| Grant date | Mar 21, 2000 |
| Priority date | — |
| Expiry date | Jun 28, 2019 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49222
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
Disclosed is a jack assembly and a jack assembly panel system for use in telecommunications equipment, as well as a method for manufacturing both. The jack assembly is a one-piece, single-molded jack assembly and the method for making the jack assembly involves placing the switch assemblies into the mold cavity and molding the framework with the switch assemblies in it. The jack assembly panel consists of numerous molded components which can be substantially snapped together for ease of assembly and resulting in a significant reduction in the number of assembly steps.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.