Patent · US Expired

Mold support frame assembly having thermally stable center

US6038886A · kind A · utility

0Cited by
12References
18Claims
0Family size

Assignee

Inventor

Key dates

Filing dateAug 19, 1998
Grant dateMar 21, 2000
Priority date
Expiry dateAug 19, 2018

Classification

  • Technology area (CPC C)Chemistry; Metallurgy
  • CPC primaryC03B23/0302
  • WIPO fieldOther special machines
  • WIPO sectorMechanical engineering

Abstract

A mold support frame assembly including a pair of mold support frames between which a connector extends and cooperates with to provide a thermally stable center. Each mold support frame includes a linkage extending between a pair of spaced legs and having a connection to a mold positioning member adjacent a centering location thereof so that thermal expansion and contraction takes place about the centering location. The connector includes a second mold positioning member that extends between the pair of mold support frames and has a second mold centering location. A second linkage extends between the pair of mold support frames and has a connection to the second mold positioning member adjacent its second mold centering location to provide thermal expansion and contraction of the second mold positioning member about its second mold centering location.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.