Reflow soldering apparatus with improved cooling
US6039236A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Jun 11, 1997 |
| Grant date | Mar 21, 2000 |
| Priority date | — |
| Expiry date | Jun 11, 2017 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K2101/40
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A reflow soldering apparatus includes a plurality of heating compartments connected in series for heating objects for soldering; transporting means for successively carrying the objects through the compartments; and at least first and second cooling compartments connected subsequent to the heating compartments for cooling the soldered objects. The first cooling compartment subjects the objects to a first, descending temperature gradient, and the second cooling compartment subjects the objects to a second, descending temperature gradient, wherein the second temperature gradient is steeper than the first temperature gradient. The objects are cooled in the first cooling chamber to a temperature below the solidification temperature of the solder.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.